PAINE 2023

IEEE International Conference on PHYSICAL ASSURANCE and INSPECTION of ELECTRONICS

About PAINE

Physical inspection of electronics have grown significantly over the past decade and is becoming a major focus for the chip designers, original equipment manufacturers, and system developers. The complex long life of the electronic devices coupled with their diverse applications are making them increasingly vulnerable to various forms of threats and inspection. Large industry and government efforts have been put in place across the globe to address related supply chain security problems to offer solutions, training and services. The number of programs introduced by US government have increased over the years to analyze and develop relevant solutions. Although much focus is given to digital domain, physical assurance and inspection of electronics as well as physical fingerprinting based on analog parameters are rapidly providing opportunities for unique countermeasures.

PAINE conference provides a unique venue to all researchers and practitioners from academia, industry, and government to have productive dialog on such topics. Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements. PAINE covers the broad topic of hardware security and trust, example topics of interest include but not limited to:

Topics to be Covered:

• Security primitives: Novel devices, materials, and systems
• New metrologies for characterization and assurance
• Additive manufacturing assurance for electronics
• Physical and design interface assurance
• Trojans and backdoors: Detection and prevention
• Workforce Development
• Advanced packaging and heterogenous integration
• Fault injection assessment and countermeasures
• Side channel assessment (power, timing, EM) for assurance and countermeasures
• Analog & mixed-signal circuits and systems security
• FPGA Bitstream protection and vulnerabilities
• Emerging topics in physical inspection and assurance
• Counterfeit Detection and Anti-Counterfeit Technique
• Image analysis and artificial intelligence for assurance and inspection
• Novel material and devices for assurance
• Sample Preparation
• PCB trust and assurance
• Chip and PCB level decomposition for assurance
• FIB/SEM for assurance
• Electro-optical probing using PEM, EOP, EOFM, etc.
• Physical/side channel fingerprinting
• Mod-chip on PCB
• Microprobing and nanoprobing
• Bus-snooping
• Field-based weakness
• Countermeasures against tampering and decomposition
• Metrologies characterization
• Functionality validation
• Process improvements
• Failure analysis and fault isolation
• Automated inspection for advanced packaging
• Physical/logical shielding etc.